Section: Advanced Composites and Applications (15th February, 2022, Riga, Latvia) : Book of Abstracts

dc.contributorGlaskova-Kuzmina,Tatjana
dc.contributor.author80th International Scientific Conference of the University of Latvia
dc.date.accessioned2022-04-13T07:39:45Z
dc.date.available2022-04-13T07:39:45Z
dc.date.issued2022-02-15
dc.description.abstractThe section ‘Advanced Composites and Applications’ was organized by the Institute for Mechanics of Materials of the University of Latvia (LU MMI) on 15.02.2022 as a part of the annual 80th scientific conference of the University of Latvia. It was organized remotely in Zoom. The official language of the section was English. The duration of the presentation was 10-15 minutes. The section was devoted to the discussion of the recent results within following topics: structure and properties of polymers and polymer-based composites, long-term properties, creep, and environmental ageing, composites for advanced applications, mechanical aspects of technology, multifunctional properties.en_US
dc.identifier.urihttps://dspace.lu.lv/dspace/handle/7/57064
dc.language.isoengen_US
dc.publisherInstitute for Mechanics of Materialsen_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.subjectResearch Subject Categories::TECHNOLOGY::Engineering mechanics::Mechanical and thermal engineeringen_US
dc.subjectResearch Subject Categories::TECHNOLOGY::Engineering mechanics::Mechanical manufacturing engineeringen_US
dc.subjectResearch Subject Categories::TECHNOLOGY::Materials science::Functional materialsen_US
dc.titleSection: Advanced Composites and Applications (15th February, 2022, Riga, Latvia) : Book of Abstractsen_US
dc.typeinfo:eu-repo/semantics/conferenceObjecten_US
Files
Original bundle
Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
2022_Advanced_Composites_and_Applications.pdf
Size:
1.12 MB
Format:
Adobe Portable Document Format
Description:
Teksts/Text
License bundle
Now showing 1 - 1 of 1
Loading...
Thumbnail Image
Name:
license.txt
Size:
1.71 KB
Format:
Item-specific license agreed upon to submission
Description: